Foundry Services

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Foundry Draft

Our foundry provides end-to-end design, manufacture and qualification for early phase prototypes and high-volume production, supporting up to 100mm wafer sizes on InP, GaAs, GaSb and GaN substrates. We have an extensive portfolio of unique production process IP, essential to high-quality, reliable, volume manufacturing.

 

FRONT-END-OF-LINE (FEOL)

Design
  • 2″, 3″ and 4″ wafers
  • All major III-V material systems
  • InP, GaAs, GaSb and GaN processing available
  • Library of InP epitaxy designs from 1270 – 1650 nm
  • Integrated design and manufacturing services for a broad range of photonic devices – FP & DFB lasers, SOAs, RSOAs, Detectors

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Lithography
  • E-beam, stepper and contact lithography
  • Front to back alignment

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MOCVD
  • InP DFB overgrowth
  • BH process TBC
  • Zinc diffusion TBC

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Wafer Processing
  • On wafer etch facet and optical coating technology
  • Wet/dry semiconductor and dielectric etching (ICP-RIE/RIE)
  • PECVD Passivation (Si3N4/SiO2)
  • Evaporated/sputtered metal
  • AuSn evaporated solder pads
  • Film stress design and balance
  • Extensive metrology (including SEM, AFM)x

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We provide custom mechanical feature optimised for hybrid integration to silicon photonic.

 

LEARN MORE – InP100 PRODUCT PLATFORM

BACK-END-OF-LINE (BEOL)

 

Facet Coating
  • AR and HR dielectric optical facet coating at bar level
  • High volume capacity with automated bar loading
  • Facet coating qualified for non-hermetic packaging
  • Wavelength range: 350nm to >3µm
  • Reflectivity range: -40dB to 90%

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Testing
  • Automated high-volume bar testing
    • LIV and spectral testing of edge emitters up to 55°C
    • > 2million lasers/month testing capacity
  • Chip-on-submounts
    • Detailed spectral analysis up to 85°C
    • Farfield 2D beam analysis

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Singulation and Assembly
  • Automated bar cleave and device singulation
  • Typical delivery formats:
    • Known-good-dies on tape (6” ring frames)
    • Singulated bars on tape (6” ring frames)
    • Singulated chips on submounts
    • Bars in Gel-Pak

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Reliability & Qualification
  • HTOL and ALT testing to Telcordia GR468
  • 2k hrs, 5k hrs & 10k hrs test durations
  • Continually monitored ACC and APC, individually addressable Newport ILX system
  • Up to 500mA, 40°C – 120°C
  • Damp-heat testing (typical 85°C/85%)
  • Detailed analysis, reliability and qualification reports

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Contact Us

We’d love to show you how Sivers Semiconductors can help transform your business—contact us for further information.

CONTACT 

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