Foundry Draft

Our foundry provides end-to-end design, manufacture and qualification for early phase prototypes and high-volume production, supporting up to 100mm wafer sizes on InP, GaAs, GaSb and GaN substrates. We have an extensive portfolio of unique production process IP, essential to high-quality, reliable, volume manufacturing.

FRONT-END-OF-LINE (FEOL)

Design

2″, 3″ and 4″ wafers
All major III-V material systems
InP, GaAs, GaSb and GaN processing available
Library of InP epitaxy designs from 1270 – 1650 nm
Integrated design and manufacturing services for a broad range of photonic devices – FP & DFB lasers, SOAs, RSOAs, Detectors

Lithography

E-beam, stepper and contact lithography
Front to back alignment

MOCVD

InP DFB overgrowth
BH process TBC
Zinc diffusion TBC

Wafer Processing

On wafer etch facet and optical coating technology
Wet/dry semiconductor and dielectric etching (ICP-RIE/RIE)
PECVD Passivation (Si3N4/SiO2)
Evaporated/sputtered metal
AuSn evaporated solder pads
Film stress design and balance
Extensive metrology (including SEM, AFM)x

We provide custom mechanical feature optimised for hybrid integration to silicon photonic.

LEARN MORE – InP100 PRODUCT PLATFORM

BACK-END-OF-LINE (BEOL)

Facet Coating

AR and HR dielectric optical facet coating at bar level
High volume capacity with automated bar loading
Facet coating qualified for non-hermetic packaging
Wavelength range: 350nm to >3µm
Reflectivity range: -40dB to 90%

Testing

Automated high-volume bar testing
- LIV and spectral testing of edge emitters up to 55°C
- > 2million lasers/month testing capacity
Chip-on-submounts
- Detailed spectral analysis up to 85°C
- Farfield 2D beam analysis

Singulation and Assembly

Automated bar cleave and device singulation
Typical delivery formats:
- Known-good-dies on tape (6” ring frames)
- Singulated bars on tape (6” ring frames)
- Singulated chips on submounts
- Bars in Gel-Pak

Reliability & Qualification

HTOL and ALT testing to Telcordia GR468
2k hrs, 5k hrs & 10k hrs test durations
Continually monitored ACC and APC, individually addressable Newport ILX system
Up to 500mA, 40°C – 120°C
Damp-heat testing (typical 85°C/85%)
Detailed analysis, reliability and qualification reports

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Foundry Services