Cloud-To-Edge Solutions
At Sivers, we design the backbone of intelligent connectivity.
From ultra-fast wireless chips to precision lasers and beamformers, our technology connects cloud to edge – powering AI data centers, advanced telecom, and SATCOM.
Our deep engineering expertise and scalable, production-ready solutions help innovators accelerate performance and bring next-generation systems to life.
Our Products
Wireless
We provide mmWave beamforming ICs, transceivers, and antenna modules that power SATCOM, Fixed Wireless Access (FWA) and 5G/6G systems—helping you achieve higher throughput, lower power consumption, flexible designs, and faster time-to-market.
Photonics
We provide high-power DFB lasers and laser arrays that drive optical links for AI datacenters and High-Performance Computing (HPC)—delivering higher bandwidth, lower power consumption, scalable designs, and reliable production at volume.
Our Applications
Driving innovation across AI, 5G/6G, SATCOM, and beyond.
Letter from the CEO: Q2 2026
Continued Opportunity Pipeline Strength and Growing Production Orders Position Sivers for 2027 Transformation
Q2 revenue was 53.8 MSEK, while Q2 AEBITDA was -35.5 MSEK. In addition to US defense budget approval delays,we have prioritized resources to enable key 2027 product ramps at the expense of NRE projects in the near-term.
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