Also working also alongside imec and Sivers on this project, is ASM AMRICA, ASM AMICRA Microtechnologies, a worldwide leading supplier of ultra-high precision die attach equipment.
In the recently completed development phase, C-band InP DFB lasers have been passively aligned and flip-chip bonded onto 300mm silicon photonics wafers with ultra-high alignment precision within 500nm (three-sigma value), resulting in reproducible on-chip waveguide-coupled laser power beyond 10mW.
Throughout the second half of 2021, the hybrid integration portfolio will be extended with reflective semiconductor optical amplifiers (RSOA), leveraging the etched-facet capability of Sivers’ InP100 technology, and ASM AMICRA NANO’s superior bonding alignment precision.
Link to original press release here.
Read the latest article from imec on the “Design and integration of photonic and electronic integrated circuits for high-speed wireline transceivers”.
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