Also working also alongside imec and Sivers on this project, is ASM AMRICA, ASM AMICRA Microtechnologies, a worldwide leading supplier of ultra-high precision die attach equipment.
In the recently completed development phase, C-band InP DFB lasers have been passively aligned and flip-chip bonded onto 300mm silicon photonics wafers with ultra-high alignment precision within 500nm (three-sigma value), resulting in reproducible on-chip waveguide-coupled laser power beyond 10mW.
Throughout the second half of 2021, the hybrid integration portfolio will be extended with reflective semiconductor optical amplifiers (RSOA), leveraging the etched-facet capability of Sivers’ InP100 technology, and ASM AMICRA NANO’s superior bonding alignment precision.
Link to original press release here.
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