International Microwave Symposium (IMS) 2024
Washington D.C.  | 16-21 June, 2024

Meet with us at IMS 2024 in Richardson RFPD booth nr 939!


Sivers Semiconductors will be attending this year’s International Microwave Symposium, which take place from 16-21 June, 2024 at Walter E. Washington Convention Center in Washington D.C., with the exhibition occurring 18-20 June.

The IMS 2024 Event is one of the biggest events dedicated to all things microwaves and RF. This flagship event attracts a variety of professionals and enthusiasts from the field who come together to explore, learn, and exchange knowledge and insight. The week also includes the IEEE MTT-S Radio Frequency Integrated Circuits Symposium (RFIC) and the Automatic Radio Frequency Techniques Group (ARFTG).

This year Sivers Semiconductors will be represented by our partner Richardson RFPD at stand #939, who will be showcasing Sivers products. We will have Sivers sales representatives in the booth to further support RFPD with deeper discussions around Sivers’ products and solutions.

We´d love to meet and get the chance to explain how we can help you enhance business and find new opportunities. Schedule a meeting at [email protected] or contact your Sivers representative directly. Or just drop by Richardson RFPD booth 939, we will be there!

Our Managing Director Sivers Wireless, Harish Krishnaswamy will be appearing on the “Voice of the Founder” Industry Panel Session as a part of the IMS 2024 Startup Program. The panel session will be held on Tuesday, 18 June 2024, 11:00 – 12:00 at MicroApps Theater, Booth 2159.

The Startup Program at IMS2024 fosters a dynamic environment where ideas meet opportunity, paving the way for fruitful collaborations and groundbreaking partnerships between visionary entrepreneurs, industry giants, and potential investors. Hear directly from Harish Krishnaswany about the stages of the MixComm journey; from early stage through generating revenue, to successfully exiting and launching the startup.

For more information visit: .



Our CTO and Head of US Division Unit, Arun Natarajan will be participating at the workshop WSM-8 “3D Integration of ICs and Antennas for Ubiquitous mm-Wave Arrays” on Sunday, 16 June 2024, in the workshop “WSM: Future of Chiplet Technology and 3D Heterogeneous Integration”, 8:00 – 17:20 at location 151AB.

Abstract: Translating large-scale mm-wave arrays to mass-market commercial SATCOM and 5G applications presents exciting challenges and opportunities. Innovation in mm-wave ICs across heterogeneous technologies must be combined with packaging approaches that consider RF, thermal, and mechanical performance while satisfying commercial cost constraints. This talk will present our work on the co-integration of mm-wave antennas and ICs for scalable arrays, demonstrating commercial solutions at 5G. We will also discuss emerging architectures that leverage heterogeneous ICs to further improve array performance and power consumption.

For more information visit:


We look forward seeing you in Washington D.C.