Partnering with world leading research centre, imec, to accelerate hybrid integration of InP lasers on SiPh PICs.
The collaboration with imec, a world-leading research and innovation center in nanoelectronics and digital technologies, began in 2019. The aim of the project is to accelerate hybrid integration of InP Lasers and Amplifiers with silicon photonics.
This would allow for the extension of silicon photonic prototyping with additional functionality, allowing customers to develop advanced photonic integrated circuits (PICs) with capabilities beyond what is possible today and to meet rising industry demand in disruptive application areas from applications from optical interconnects, over LiDAR, to biomedical sensing.
A significant milestone was reached in June 2021, with the successful wafer-scale integration of indium phosphide (InP) distributed feedback (DFB) lasers from onto imec’s silicon photonics platform (iSiPP).
Also working also alongside imec and Sivers on this project, is ASM AMRICA, ASM AMICRA Microtechnologies, a worldwide leading supplier of ultra-high precision die attach equipment.
In the recently completed development phase, C-band InP DFB lasers have been passively aligned and flip-chip bonded onto 300mm silicon photonics wafers with ultra-high alignment precision within 500nm (three-sigma value), resulting in reproducible on-chip waveguide-coupled laser power beyond 10mW.
Throughout the second half of 2021, the hybrid integration portfolio will be extended with reflective semiconductor optical amplifiers (RSOA), leveraging the etched-facet capability of Sivers’ InP100 technology, and ASM AMICRA NANO’s superior bonding alignment precision.
Link to original press release here.
Read the latest article from imec on the “Design and integration of photonic and electronic integrated circuits for high-speed wireline transceivers”.
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