Sivers Semiconductors AB (publ) (“Sivers”) today announces that its US subsidiary, Sivers Semiconductors Inc., has received a USD 375,000 award under the Defense Advanced Research Projects Agency (DARPA) Next-Generation Microelectronics Manufacturing (NGMM) program in collaboration with PseudolithIC Inc. The program aims to develop three-dimensional heterogeneously integrated (3DHI) technologies to enable the disruptive microsystems of tomorrow. PseudolithIC Inc. and Sivers will specifically investigate 3DHI systems for mmWave applications in the 5G, SATCOM and defense sectors. 

The DARPA Next-Generation Microelectronics Manufacturing (NGMM) program will advance the next major wave in microelectronics manufacturing, namely three-dimensional heterogeneous integration (3DHI), which involves the heterogeneous integration of disparate materials and components, enabled by advanced packaging that leverages all three dimensions. The DARPA NGMM program is a complementary effort to the US CHIPS ACT, a $52.7B program designed to invigorate American semiconductor research, development, manufacturing, and workforce development. Sivers and Pseudolithic will specifically focus on the heterogeneous integration of Sivers’ industry-leading, high-performance RF SOI beamformers with III-V front ends for millimeter-wave 5G, SATCOM and defense applications.

One of our major goals with the acquisition of MixComm (today part of Sivers Wireless), was to get a better footprint in the US market. I cannot see any better acknowledgment than getting this award from the DARPA NGMM program. Working in this project on the next generation mmWave applications in the 5G, SATCOM and for the defense sectors is a fantastic step for Sivers,” says Anders Storm, Group CEO, Sivers Semiconductors.

Dan Green, PseudolithIC CEO, stated, “PseudolithIC is thrilled to partner with Sivers in support of DARPA’s NGMM program. We are excited to team PseudolithIC’s innovative heterogeneous integration technology with the proven performance of Sivers RF SOI beamforming chipsets.  This combination of silicon and III-V technology will enable access to the millimeter-wave spectrum with performance and scale surpassing any single, monolithic technology."

Sivers expects all of this revenue to be recognized in 2023.

For more information please contact:
Anders Storm, CEO
Tel: +46 70 262 6390
[email protected]

Distribution Statement “A” – Approved for Public Release, Distribution Unlimited

Sivers Semiconductors AB is a leading and internationally recognized technology company that supplies ICs and integrated modules through its two business areas Wireless and Photonics. Wireless develops mmWave products for advanced 5G systems for data and telecommunications networks and satellite communication. The portfolio includes RF transceivers, beamforming front end ICs, integrated mmwave antennas, repeaters, and software algorithms for optimum mmWave RF performance. Photonics develops and manufactures semiconductor based optical products for optical fiber networks, sensors and optical fiber communications (Li-Fi). The company is listed on Nasdaq Stockholm under SIVE. The head office is located in Kista, Sweden. For more information: