High-Power DFB Lasers for Advanced Sensing Applications
Sivers Photonics’ DFB laser chips deliver compact, stable, and efficient light sources for consumer sensing applications — from biometric and health monitoring to material and environmental detection. Our technology enables precise,
reliable, and cost-effective solutions for next-generation smart devices.OEMs and device manufacturers developing optical sensing modules for wearables, AR/VR systems, health monitors, and smart home devices.
Why Sivers for Sensing?
High-yield ridge-waveguide and dual-ridge architectures ensure consistent wavelength control and performance.
Ultra-low FIT rates (<1) deliver unmatched dependability for high-volume consumer products.
Etched-facet, on-wafer coated design allows full optical testing before dicing — reducing cost and improving reliability.
Lasers can be optimised for seamless hybrid SiPh integration.
On-wafer coating and testing eliminate bar processing, improving yield and scalability.
What Problems We Solve
Consumer sensing applications demand compact, efficient, and reliable light sources that maintain precise wavelength control for accurate detection. Traditional DFB and edge-emitting lasers often require costly bar-level processing and struggle to meet yield and cost targets.
Sivers’ etched-facet wafer-level process delivers high-yield, low-cost DFB lasers that combine narrow-linewidth stability with high performance, enabling OEMs to scale production efficiently while maintaining precision and reliability.
Key Benefits
- Output powers up to 100mW across a range of wavelengths from 1200nm-2400nm
- Ridge-waveguide architecture ensures high yield, low cost, and stable single-mode operation.
- Etched-facet, on-wafer coating and testing eliminate bar processing and reduce manufacturing costs.
- Array format supports precise wavelength control for multi-channel sensing systems.
- Non-hermetic compatibility lowers packaging complexity and cost.
Product Portfolio
We focus on InP sources optimised for silicon photonics integration. We offer high power, InP-based DFB lasers and gain chips, as single emitters or arrays, on our InP100 Product Platform

InP100 Platform Advantages
- Wafer-level processing and testing for scalability and cost efficiency.
- Proven architecture with ultra-low FIT rates for long-term reliability.
- Flexible customization options for power, wavelength, and form factor.
- Non-hermetic compatibility lowers packaging complexity and cost.
FAQ
Yes see our product portfolio for a range of standard devices currently underqualification. We can provide you with data sheets, samples and lead times for each. Don’t see what you’re looking for? Please reach out, our team will be happy to discuss your requirements.
Absolutely. Our in-house design team can take you from initial concept through custom design, prototyping, qualification, and into high-volume manufacturing.
InP100 is our 4” Indium Phosphide processing platform – a library of qualified process modules that can be combined to build a wide range of devices. By using these proven building blocks, InP100 ensures that both established and new design concepts have the strongest chance of success from the start.
Not at this time. We provide each customer with a dedicated wafer run, giving you full flexibility to explore design options and optimize for your specific performance targets.
There’s no strict minimum. Our goal is to support you from prototyping through to high volumes. We understand every project is unique, so we’ll assess your request individually and build the right plan together.
We run a 24/7 fab and always aim to deliver as quickly as possible. Cycle time varies based on complexity and production load, but we’ll work closely with you to create a schedule that fits your needs.