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High-Power DFB Lasers for Advanced Sensing Applications

Sivers Photonics’ DFB laser chips deliver compact, stable, and efficient light sources for consumer sensing applications — from biometric and health monitoring to material and environmental detection. 
Our technology enables precise,

reliable, and cost-effective solutions for next-generation smart devices.OEMs and device manufacturers developing optical sensing modules for wearables, AR/VR systems, health monitors, and smart home devices.

Why Sivers for Sensing?

High-yield ridge-waveguide and dual-ridge architectures ensure consistent wavelength control and performance.

Ultra-low FIT rates (<1) deliver unmatched dependability for high-volume consumer products.

Etched-facet, on-wafer coated design allows full optical testing before dicing — reducing cost and improving reliability.

Lasers can be optimised for seamless hybrid SiPh integration.

On-wafer coating and testing eliminate bar processing, improving yield and scalability.

What Problems We Solve

Consumer sensing applications demand compact, efficient, and reliable light sources that maintain precise wavelength control for accurate detection. Traditional DFB and edge-emitting lasers often require costly bar-level processing and struggle to meet yield and cost targets. 


Sivers’ etched-facet wafer-level process delivers high-yield, low-cost DFB lasers that combine narrow-linewidth stability with high performance, enabling OEMs to scale production efficiently while maintaining precision and reliability.

Key Benefits

  • Output powers up to 100mW across a range of wavelengths from 1200nm-2400nm
  • Ridge-waveguide architecture ensures high yield, low cost, and stable single-mode operation.
  • Etched-facet, on-wafer coating and testing eliminate bar processing and reduce manufacturing costs.
  • Array format supports precise wavelength control for multi-channel sensing systems.
  • Non-hermetic compatibility lowers packaging complexity and cost.